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How to select grinders between Vertical Spindle Rotary Table Grinders VS Horizontal Spindle Rotary Table Grinders?

How to select the grinders between Vertical Spindle Rotary Table Grinders and Horizontal Spindle Rotary Table Grinders?


What are the Key Differences Between Vertical Spindle Rotary Table Grinders and Horizontal Spindle Rotary Table Grinders for Machine Model Selection?

This comparison highlights the core distinctions to help you choose the most suitable grinding machine for your application.


Vertical Spindle Rotary Table Grinder



• Principle: 

The grinding spindle is perpendicular to the worktable (vertical), using the face of the grinding wheel. The worktable rotates horizontally.

• Key Characteristics:
Large Contact Area: The entire wheel face contacts the workpiece, enabling a very high metal removal rate and exceptional productivity.
High Rigidity: Robust spindle structure withstands heavy grinding forces.
Primary Focus: Efficiency and stock removal for achieving flatness.

Typical Tolerance & Finish: Generally suited for lower surface roughness and dimensional precision compared to horizontal spindle types of the same class.



• Primary Applications:
1. Roughing/Semi-finishing of large surfaces in mass production (e.g., engine blocks, transmission cases, machine bed castings).
2. High-efficiency grinding of difficult-to-machine materials (e.g., titanium alloys, aerospace components).
3. Mold industry: Stock removal and surface grinding for large mold bases.
4. Form grinding and slicing of non-metallic hard/brittle materials like magnetic materials or ceramics.



Horizontal Spindle Rotary Table Grinder

H grinder


• Principle: The grinding spindle is parallel to the worktable (horizontal), using the periphery of the grinding wheel. The worktable rotates horizontally.
• Key Characteristics:
Small Contact Area: The wheel contacts the workpiece with its high-speed periphery, resulting in low grinding force and minimal heat generation.
Superior Accuracy: Stable process delivers extremely high flatness, parallelism, and very low surface roughness.
Effective Cooling & Chip Removal: Open grinding zone allows optimal coolant flow and chip evacuation.
Primary Focus: Ultimate precision and fine surface finish.

Efficiency: Lower stock removal per pass, best for finishing.

H grinding workpiece

• Primary Applications:
1. Precision & ultra-precision finishing of components like hydraulic parts (pump/valve faces), precision bearing rings, gauges, piston rings.
2. Thin-part grinding: Low grinding force minimizes distortion, ideal for shims, friction discs, saw blades.
3. Tool industry: Precision surface grinding of carbide/ceramic inserts.
4. Semiconductor & optics: Precision lapping/grinding of silicon wafers, optical glass, crystals (often with specialized wheels).



For more information about these two models of grinding machines, please feel free to contact us.


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Tech EDM Trade Co., Ltd

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   2025-12-25
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